교수소개

어영선 교수

전자공학부

연락처 : 031-400-5295

담당과목

학부: 집적회로설계, 아날로그회로설계, 전자기학
Graduate: 고급집적회로설계, 시스템레벨집적기술, 시그널/파워 인테그러티

관심연구분야

고속집적시스템설계, 시스템레벨 집적기술, System in a Package (SIP), System on a Chip (SOC), 온-칩 배선의 시그널 인테그러티 검증, IC-패키지 및 소자의 특성화 및 모델링, 집적 시스템 시뮬레이션

학력

 1979-1985: 한양대학교 전자공학과 공학사, 공학석사
 1988-1993: (미) The University of Florida, 전자공학과 공학박사

경력

 2002 - 현재 : Senior Member of IEEE and Technical Committee Member of ASP-DAC, ISOCC
 1995 - 현재 : 한양대학교 교수
 2011 - 2012 : Samsung Electronics, (System LSI), Giheung, Korea, Technical Consulting Professor
 2004 - 2005 : NIST (National Inst. of Standards and Tech.), Boulder, CO, USA, Guest Researcher.
 1994 - 1995 : LSI Logic Corporation, R&D Center, Santa Clara, CA, U.S.A., Sr. Engineer
 1993 - 1994 : AMCC (Applied Micro Circuits Corporation), San Diego, CA, U.S.A., Sr. Engineer
 1989 - 1993 : University of Florida. Dept. of Electrical Eng., Gainesville, U.S. A., Research Assistant
 1986 - 1988 : Korea Telecommunication Research Center, Seoul, Korea, Research Engineer

주요연구과제

 2005. 08 - 2008. 07 SI/PI를 고려한 SoP설계/ 삼성전기
 2007. 11 - 2008. 12 UWB 복합 메모리카드 개발/ 삼성테크윈
 2007. 11 - 2008. 12 SOC 칩 내부 파워/그라운드 노이즈의 측정 및 분석 기술 개발/ 삼성전자
 2009. 05 - 2012. 04 PCB 기반 이동통신 시스템 모듈의 SIP칩 (system in a package)화 설계 기술 개발/ 한국연구재단
 2012. 02 - 2014. 10 밀리미터파 평판 구조체의 측정분석/ 한국표준과학연구원

주요논문

 Dongchul Kim, Hyewon Kim, and Y. Eo, "A Novel Transmission Line Characterization Based on Measurement Data Reconfirmation" will be published in International Journal  of Electronics, Feb., 2013.
 Dongchul Kim, Hyewon Kim, and Y. Eo, "Analytical Eye-Diagram Determination for the Efficient and Accurate Signal Integrity Verification of Single Interconnect Lines,"
 IEEE Trans. CAD., vol. 31, No. 10, pp. 1536-1545, Oct. , 2012.
 Hyewon Kim, Dongchul Kim, and Y. Eo, "Experimental characterization and signal integrity verification of interconnect lines with inter-layer vias," Journal of Semiconductor
 Technology and Science, vol. 11, No. 1, pp. 15-21, Mar, 2011.
 Hyunsik Kim and Y. Eo, "Analytical signal integrity verification of multi-coupled interconnect lines using novel unified decoupling algorithm," IEICE Trans. on Fundamentals,
 vol. No. 4, pp. 752-760, Apr., 2010.
 Dongchul Kim and Y. Eo, "S-parameter-measurement-based time-domain signal transient and crosstalk noise characterizations of coupled transmission lines," IEEE Trans.  Advanced Packaging, , vol. 32, No. 1, pp. 152-163, Feb., 2009.
 Heungkyu Kim and Y. Eo, "High-frequency-measurement-based circuit modeling and power/ground integrity evaluation of integrated circuit packages," IEEE Trans.
 Advanced Packaging, vol. 31, No. 4, pp. 910-918, Nov., 2008.
 T. Kim and Y. Eo, "Analytical CAD models for signal transients and crosstalk noise of inductance-effect-prominent multi-coupled RLC interconnect lines," IEEE Trans. CAD,  vol. 27, No. 7, pp.1214-1227, July, 2008.
 H. Kim, S. C. Ji, and Y. Eo, "A new frequency-variant transmission line parameter determination technique for very high-speed propagation characterization," in Proc.
 Signal and Power Integrity (SPI), May 13-16, Italy, pp. 133-136, 2012.
 D. Kim, H. Kim, and Y. Eo, "Sginal Integrity Verification of Coupled Interconnect Lines Using Efficient Eye-Diagram Determination," IEEE International Symposium on Circuits
 and Systems (ISCAS), May 30-Jun. 2, France, pp. 3669-3672, 2010.